Quote:
Originally Posted by Nage Waza
From what I know, the RROD is typically caused by defective thermal paste on the video card. It does not matter how cool you make the system, the gel was bad. RROD can be cured (for a short time) by overheating the system! Wrap the system in a blanket, the gel eventually melts over the parts again, and you are good to go, for a while.
The 360 is a great system, unfortunately there have been some major tech issues. I went through 3 or 4 from the release date, the last unit has lasted since month five. I don't know if Microsoft can really be blamed for this; this is such a small yet critical aspect of the build that if it is bad from the get-go than systems are going to fail.
I don't even know if there is a class action lawsuit for this.
|
Completely false and stupid playground rumor started by teenagers who don't know what they are doing. There's no such thing as burning in or reheating thermal paste or thermal pads. Heating thermal paste (typically silicon emulsion) will only reduce the moisture content future, and make it more brittle. If you really are worried about the thermal paste, void your warranty, open your system. Remove the heatsink and heatpipe assembly, and apply some Arctic Silver.
As I stated before. The problem is due to the leadless solder. Temperature fluxes or cold solder joints cause the ball grid array solder to crack or separate between the GPU and CPU and the motherboard. The same issue happened with nvidia graphics chips in several laptops last year causing their stock price to plummet.
BTW, Microsoft recommends not using an intercooler because it takes it's power by going into the power chain between the powersupply and the unit and earlier versions were known to damage the console or prevent it from getting enough power.
Never revisions like the Jasper are switching to 65nm fabrication which consumes less power and generates less heat but RROD is still possible if the solder joints fail.